18B – Building Global Talent through International University-Industry Partnerships: Lessons from Indonesia

14:00 - 14:30 24/03/27 ROOM MY 05 - 08

Abstract

The AI revolution rests in large part on semiconductors, and demand continues to grow. Even as automation reshapes how chips are designed and made, skilled talent remains essential, and is becoming the limiting factor. Indonesia is among the countries now seeking to enter the global semiconductor ecosystem. With design and fabrication capacity still at an early stage, but one of the world’s largest and youngest populations to draw upon, the country is working to catch up and build the skilled workforce required. This session considers how international partnership can support that effort.

Drawing on the experience of Institut Teknologi Sepuluh Nopember (ITS), Indonesia, and its collaboration with a US university, Arizona State University (ASU), it describes how a broad STEM partnership grew into a more focused semiconductor workforce and curriculum agenda: industry-aligned microcredentials, an incubation and venture-pitch pathway, faculty exchange, and links to national industry, government, and the Indonesia Chip Design Collaborative Center (ICDEC). It also reflects on complementary cooperation with regional universities in Southeast and East Asia. The session considers what partners beyond Indonesia and other related STEM field may gain: regional engagement, research collaboration, and most importantly, a growing talent base.

Learning objectives

  • Appreciate how an emerging economy such as Indonesia approaches entry into the global semiconductor ecosystem, and the workforce challenge of catching up.
  • Consider how international and US university partners can gain research links, regional reach, and access to an emerging talent base through such collaboration.
  • Reflect on how a host institution in developing countries like ITS can contribute meaningfully as a collaborator when program planning rests mainly with the international partner, offering local context, adaptation, and connection to its own networks.
  • Explore how regional and cross-border ties, including with Southeast and East Asian universities, can sustain a shared talent pipeline.

Target audience

Program and curriculum leads, deans, and international officers interested in industry-aligned program design, semiconductor and STEM workforce development, microcredentials, and the gradual building of regional talent pipelines through international and North–South partnerships across the Asia-Pacific.

Session members

Click underlined name to view biography.

Session members will be added shortly once they have confirmed their participation.

Presentations

Key Dates

General Proposal Submissions

General Proposal Submission:
24 June 2026 23:59 AEST Closed

Proposal notifications:
late September 2026

Academic Research Submissions

Phase 1: Abstract Submission:
3 June 2026 Closed

Phase 2: Full Paper Submission (for accepted abstracts):
12 August 2026 Closed

Phase 3: Revised Full Paper Submission (incorporating reviewer feedback):
12 November 2026

Registration

Early bird open: from mid-September 2026
Early bird close: 12 January 2027
Standard open: 13 January 2027
Standard close: 20 March 2027
Late open: 21 March 2027

APAIE 2027 Conference & Exhibition

Pre-conference workshops: 21 March 2027
APAIE 2027 Kuala Lumpur: 21 – 25 March 2027
Post-conference campus tours: 25 March 2027

Submissions

Proposal submission: 24 April – 24 June 2026
Research submission: 24 April – 3 June 2026
Pre-conf workshop submission: 24 April – 3 June 2026

Early bird open: from mid-Sepember 2026
Early bird close: 12 January 2027
Standard open: 13 January 2027
Standard close: 20 March 2027
Late open: 21 March 2027